Low ohmic-contact resistance in recessed-gate normally-off AlGaN/GaN MIS-HEMT with δ-doped GaN Cap Layer

Akio Wakejima,Akira Ando, Akio Watanabe, Keiichi Inoue, Tomio Kubo, T Nagai, Naoto Kato,Yukio Osada,Ryuichiro Kamimura,Takashi Egawa

2015 73rd Annual Device Research Conference (DRC)(2015)

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摘要
Summary form only given. In this paper, we discuss an ohmic contact resistance (R c ) in a recessed-gate normally-off AlGaN/GaN MIS-HEMT with a δ-doped GaN Cap Layer. This structure ensures high uniformity of a threshold voltage (V th ) by a selective dry-etching of GaN over AlGaN at a gate region. At the δ-doped region of the GaN cap layer, diffusion of electrons toward the surface leaves excess ionized donors, resulting in compensation of negative polarization charges between the GaN cap and the AlGaN barrier. Thanks to this effect, we successfully obtained an low R c of less than 0.1 Ωmm by reduction of band-barrier at the interface between the GaN cap and the AlGaN barrier.
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关键词
low ohmic contact resistance,recessed gate normally-off MIS-HEMT,cap layer,threshold voltage uniformity,selective dry etching,negative polarization charge compensation,band barrier reduction,AlGaN-GaN
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