Failure Analysis And Optimization Of Metal Fuses For Post Package Trimming

2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL(2007)

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摘要
Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.
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关键词
failure analysis,electric resistance,statistical analysis,integrated circuit packaging,geometry,chip,fuses
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