Impact of Very Low Hf Concentration (Hf=6%) Cap Layer on Performance and Reliability Improvement of HfSiON -CMOSFET with EOT Scalable to 1nm

international electron devices meeting(2006)

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摘要
The authors have demonstrated the stacked MOCVD HfSiON gate dielectrics with extremely low Hf concentration (Hf/(Hf+Si)=6%) cap (LHC) which realized improved mobility and superior long-term reliability of CMOSFETs while maintaining low gate leakage currents and EOT scalability to 1nm. These superior electrical characteristics of the film are mainly owing to the suppression of the Vo2+ formation in the LHC layer, which is evidenced by first principle calculation
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关键词
reliability,mocvd,leakage current,dielectric materials
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