A 60-GHz LNA and a 92-GHz Low-Power Distributed Amplifier in CMOS with Above-IC

2008 European Microwave Integrated Circuit Conference(2008)

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摘要
This paper demonstrates a broadband LNA for 60-GHz WPAN and a 92-GHz low-power distributed amplifier (DA) in an advanced CMOS technology. A post-processed technology (above-IC), used for packaging and bonding pads redistribution, provides ultra-low-loss on-chip passives in a cost-effective solution. In the WPAN bandwidth (57-64 GHz), the LNA has a 13.4 dB peak gain, a NF between 5.6-6.7 dB and a gain flatness of 1.7 dB. A 3-dB bandwidth of 11 GHz is achieved. The DA shows a 6.5 dB gain and a 3-dB BW of 92 GHz, giving a 195 GHz gain-bandwidth product (GBW), for a dc power consumption of 43 mW. Thank to the asset of Above-IC, this DA performs a ratio of the GBW and power consumption of 4.31 GHz/mW, which is by far the best reported tradeoff among similar architecture in CMOS, at least 2.8 times higher than others.
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关键词
LNA,low-power distributed amplifier,above-IC,CMOS technology,post-processed technology,bonding pads redistribution,ultralow-loss on-chip,WPAN bandwidth,dc power consumption,gain-bandwidth product,frequency 92 GHz,frequency 57 GHz to 64 GHz,gain 13.4 dB,noise figure 5.6 dB to 6.7 dB,gain 1.7 dB,bandwidth 11 MHz,gain 6.5 dB,bandwidth 195 GHz,power 43 mW
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