Machining parameter optimization of C/SiC composites using high power picosecond laser

•We found that the helical line width and the helical line spacing, machining time and the scanning speed on the surface morphology of machined holes had remarkable effects on the qualities of micro-holes such as shape and depth.•The debris consisted of C, Si and O was observed on the machined surface. The SiC bonds of the SiC matrix transformed into SiO bonds after machined.