Low Dielectric And High Thermal Conductivity Epoxy Nanocomposites Filled With Nh2-Poss/N-Bn Hybrid Fillers

Hybrid fillers of mono-amine polyhedral oligomeric silsesquioxane/nanosized boron nitride (NH2-POSS/n-BN) were performed to fabricate NH2-POSS/n-BN/epoxy nanocomposites. Results revealed that the dielectric constant and dielectric loss values were decreased with the increasing addition of NH2-POSS obviously, but increased with the increasing addition of BN fillers. For a given loading of NH2-POSS (5 wt %), the thermal conductivities of NH2-POSS/n-BN/epoxy nanocomposites were improved with the increasing addition of n-BN fillers, and the thermal conductivity of the nanocomposites was 1.28 W/mK with 20 wt % n-BN fillers. Meantime, the thermal stability of the NH2-POSS/n-BN/epoxy nanocomposites was also increased with the increasing addition of n-BN fillers. (c) 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015, 132, 41951.