Rapid bonding enhancement by auxiliary ultrasonic actuation for the fabrication of cyclic olefin copolymer (COC) microfluidic devices

Thermal compression bonding is a straightforward, inexpensive and widely used method for enclosing open microchannels in thermoplastic microfluidic devices. It is advantageous over adhesive, solvent and grafting bonding methods in retaining material homogeneity. However, the trade-off between high bond strength and low microchannel deformation is always a crucial consideration in thermal compression bonding. In this study, an effective method for improving bond strength while retaining the microchannel integrity with negligible distortion is proposed and analyzed. Longitudinal ultrasonic actuation was applied to the preheated cyclic olefin copolymer (COC) substrates to achieve accelerated and enhanced bonding with an ultrasonic welding system. Intimate contact between the bonding surfaces before the ultrasonic actuation was found to be an important prior condition. With improper contact, several bonding defects would occur, such as voids, localized spot melting and edge melting. Under auxiliary ultrasonic vibration, within 10 s, the bond strength developed at the bonding interface could be dramatically improved compared with those achieved without ultrasonic actuation. The enhanced bond strength obtained at a preheating temperature of 20 degrees C lower than its T-g could be comparable to the strength for pure thermal compression at 5 degrees C higher than its T-g. It is believed that the ultrasonic energy introduced could elevate the interfacial temperature and facilitate the interdiffusion of molecular chain segments at the interface, consequently resulting in rapidly enhanced bonding. Also, the microchannel distortion after ultrasonic actuation was found to be satisfactory-another important requirement. From dynamic mechanical analysis, the glass transition temperature of COC was found to increase with increasing frequency, and the temperature of the bulk polymer under ultrasonic actuation was still well under T-g; therefore the deformation is minor under ultrasonic actuation.