Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

The lack of statistical homogeneity in functional SnAgCu (SAC) solder joints due to their coarse grained microstructure, in conjunction with the severe anisotropy exhibited by single crystal Sn, renders each joint unique in terms of mechanical behavior. A mechanistic multi-scale modeling framework is proposed in this study to predict the influence of composition and microstructure on the anisotropic transient creep response of single crystal SnAgCu (SAC) solder. Tier I consist of single-crystal eutectic Sn–Ag alloy, with nanoscale Ag3Sn particles embedded in a single-crystal Sn matrix. Tier II consists of single crystal SAC solder which is composed of Sn dendrites surrounded by the eutectic Sn–Ag phase of Tier I. The Tier I anisotropic transient creep model is based on dislocation mechanics. The Tier II model uses the results of Tier I as an input and is based on anisotropic composite micro-mechanics.