Surface dispersion engineering of Ag–Au alloy films

By controlling the content ratio of Ag and Au during the metal co-sputtering process, we demonstrate that the surface dispersion properties of alloy metal films can be manipulated with no need to tune the geometric parameters for surface patterns. This inexpensive technology provides a different way to engineer the surface dispersion properties of plasmonic metamaterial components on a chip. (C) 2015 The Japan Society of Applied Physics