20.4 Design and Migration Challenges for an Alpha Microprocessor in a 0.18µm Copper ProcessRay Hokinson,Bradley J Benschneider,M Arneborn,Daniel C Clay,J Clouser, S A Dumford, V Kalathur, V Kalidindi, S Kovvali, Jurgen Krause,S Maresh, W Munger, Norm T Oneill, I Pragaspathy, Wei Qin,Reiko Sasamori,Sami Sayadi,Tarunraj Singh, Jian Tang,M Tracz, S P Watkinsinternational solid-state circuits conference（2001）引用 0|浏览4暂无评分关键词land grid array,flip chip,copperAI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
