Mechanical packaging, power, and cooling design for the IBM z13.

John G. Torok,Frank E. Bosco,Gary F. Goth,John J. Loparco,M. T. Peets, Donald W. Porter, S. G. Shevach, B. C. Tucker,A. C. VanDeventer,X. Wei, P. A. Wendling,Y. Yu,R. J. Zoodsma

IBM Journal of Research and Development（2015）

引用 7|浏览44

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摘要

The system-level packaging of the IBM z13™ supports the implementation of a new drawer-based Central Processor Complex (CPC). Departing from previous IBM z Systems™ designs, the introduction of distributed land-grid-array (LGA) attached single-chip modules (SCMs) required new mechanical, power, and cooling designs to address specified performance requirements and to provide enhanced reliability, a...

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关键词

System-level packaging ,Connectors,Cooling,Packaging,Integrated circuit interconnections,Program processors

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