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A new creep–fatigue life model of lead-free solder joint

Yongxin Zhu,Xiaoyan Li,Chao Wang,Ruiting Gao

Microelectronics Reliability（2015）

Cited 16|Views5
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Abstract
•Creep and fatigue damage are accumulated in different loading stage.•A new life prediction model was proposed under high strain rate.•Bilinear interaction diagram modification can improve the new model accuracy.
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Key words
Solder joint,Creep,Fatigue,Life prediction
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