Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval Coudrain,Papa Momar Souare,Rafael Prieto,Vincent Fiori,Alexis Farcy, Laurent Le-Pailleur,Jean-Philippe Colonna,Cristiano Santos,Pascal Vivet,M. Haykel Ben Jamaa,Denis Dutoit,François de Crecy,Sylvain Dumas,Christian Chancel,Didier Lattard,Séverine Cheramy

IEEE Design & Test（2016）

引用 24|浏览65

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摘要

This article describes heat dissipation challenges in 3-D ICs; using two case studies, it also presents insights and design guidelines for 3-D thermal management.

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关键词

Three-dimensional displays,Design methodology,Thermal management,Integrated circuit interconnections,Integrated circuit modeling,Temperature measurement,Three-dimensional displays,Design methodology,Integrated circuit interconnections,Integrated circuit modeling,Temperature measurement

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