Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes.

Shreepad Panth,Sandeep Kumar Samal,Kambiz Samadi,Yang Du,Sung Kyu Lim

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems（2017）

引用 15|浏览46

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摘要

Monolithic 3-D ICs (M3-D ICs) offer extremely high vertical interconnection density, significantly improving the power-performance envelope when compared to conventional 2-D ICs. However, process limitations lead to one tier having either degraded transistors or interconnects. This paper models the amount of degradation that can be expected at current and future nodes (45, 22, and 10 nm), develops...

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关键词

Degradation,Transistors,Copper,Conductivity,Three-dimensional displays,Integrated circuit interconnections

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