Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems(2018)
摘要
Thermomechanical stress is one of the most important issues in performance and reliability analysis of through silicon via-based 3-D integrated circuits (3-D ICs), where an accurate numerical approach is generally needed to produce stress models and identify weak points in the structure. In this paper, we propose a knowledge-oriented nonuniform (KONU) refinement strategy for 3-D IC stress simulati...
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关键词
Stress,Finite element analysis,Integrated circuit modeling,Reliability,Analytical models,Mathematical model
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