Towards a World of More Functions in Integrated Sustainable Systems
2018 25th International Conference "Mixed Design of Integrated Circuits and System" (MIXDES)（2018）
摘要
Major power consumption reduction will drive future design of technologies and architectures that will request less greedy devices and interconnect systems. The electronic market will be able to face an exponential growth thanks to the availability and feasibility of autonomous and mobile systems necessary to societal needs. The linear scaling of CMOS has encountered, since its beginning, many hurdles which request new process modules, driven mainly by the maximization of energy efficiency [1].
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关键词
CMOS devices,scaling,FDSOI,FinFET,variability,energy efficiency,nanoelectromechanical systems,single electron,memories,RERAMs,wafer bonding,monolithic 3D,co integration,neuromorphic architectures,hybrid integration,Tunnel FET,heterogeneous integration,energy harvesting,thin film batteries
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