谷歌浏览器插件
订阅小程序
在清言上使用

A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches

ESSCIRC(2018)

引用 6|浏览76
暂无评分
摘要
3D TSV integration enables scalable manycore architectures, however they require advanced cache coherence features to enable simple programming models. We propose TSARLET, a general purpose 16-core computing fabric targeting 3D TSV integration with a fully scalable cache coherent memory architecture, using distributed L2-caches, and adaptive fault tolerant L3-caches. Implemented in 28nm UTBB FDSOI technology, the circuit operates up to 1.15 GHz using adaptive clocking and provides 29 Gops/W in the 0.5-1.3V supply range. The chip's performance is demonstrated using an image filter application and an OpenMP based Convolutional Neural Network (CNN) on Linux.
更多
查看译文
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要