Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application

In this paper, we review a variety of hybrid III/V-on-silicon integration platforms with focus on the optical coupling between III/V and silicon waveguides. Numerical simulations with regard to the coupling efficiency are conducted for various mode-overlapped and adiabatic-coupled structures for future design guideline. As a highlight, we show a novel wafer-scale dies-transfer bonding technology t...