Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, pp. D3008-D3013, 2016.
A novel process for electrochemical atomic layer deposition (e-ALD) of copper is presented. In this process, a sacrificial monolayer of zinc (Zn) is formed via underpotential deposition (UPD) on a copper (Cu) or ruthenium (Ru) substrate. The sacrificial Zn monolayer then undergoes surface-limited redox replacement (SLRR) by nobler Cu. Thi...More
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