Optimization of the diffusion bonding parameters for SS316L/CuCrZr with and without Nickel interlayer

Divertor & Firstwall module of ITER like tokamak has several joints of dissimilar materials such as Tungsten (W) to Copper (Cu), Cu to CuCrZr (heat sink material) and CuCrZr to Stainless Steel (SS) materials. These Plasma Facing Components (PFC) are made of multi-layered joints, which are to be exposed to the harsh environment of Plasma with the expected heat flux of 5-10 MW/m(2). The joining of SS316L material to CuCrZr material is proposed in this paper. As SS316L/CuCrZr being dissimilar materials, direct joining of these materials is a problem, which needs a suitable fabrication process. The joining of SS316L with heat sink material (CuCrZr) requires the good thermal transfer and sound in structural joint. Diffusion bonding technique has been adopted as a process for joining of these two dissimilar materials. The primary objective of the joining study is to obtain the best diffusion bonding parameters for ITER like tokamak application. Thermo-mechanical simulator machine (Gleeble 3800) is used to perform diffusion bonding experiments at different temperatures 650 degrees C, 850 degrees C, 900 degrees C, 950 degrees C & 1000 degrees C, different uniaxial pressure varying from 5 MPa to 15 MPa and with the holding time of 15 min & 30 min, using pure nickel interlayer. The diffusion bonded samples have undergone Non-destructive testing (NDT) particularly the ultrasonic examination using immersion probe technique, microstructural examination by the High Resolution (HR) electron microscopy (SEM), Energy Dispersive X-ray (EDAX) analysis, micro hardness measurement and shear measurements by custom made fixture. The diffusion bonding parameter of SS316L/CuCrZr is optimized based on study with Nickel (Ni) interlayer and without interlayer. The details of fabrication procedure and the results of the characterization are discussed and presented in this paper. (C) 2016 Elsevier B.V. All rights reserved.