Study Of Diffusion Bonding Of WL10 To SS Joining With & Without Titanium Interlayer Using Thermo Mechanical Simulator

Diffusion bonding of WL10 material and SS material has been carried out by using Thermo mechanical simulator machine (Gleeble 3800) at various temperatures 800°C, 850°C, 900°C, 950°C & 1000°C with uniaxial pressure 5 MPa to 20 MPa and hold time of 15 Min & 30 Min with and without titanium interlayer. The joint specimens have been investigated by NDT (Ultrasonic Testing by immersion probe technique), microstructural examination and hardness measurement. In this paper, the methodology for the preparation of diffusion bonding and optimization of the diffusion bonding parameters for the joining of WL10 and SS material is discussed.