Notice of Violation of IEEE Publication Principles: In-line wideband contactless GrooveGap to microstrip transition with PMC packaging for MMIC integration in gap waveguide technology

2016 Loughborough Antennas & Propagation Conference (LAPC)(2016)

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Notice of Violation of IEEE Publication Principles

In-Line Wideband Contactless GrooveGap to Microstrip Transition with PMC Packaging for MMIC Integration in Gap Waveguide Technology
by Carlos Sanchez-Cabello, Luis Inclan-Sanchez, Jose Luis Vazquez-Roy, Eva Rajo-Iglesias
in the Proceedings of the Loughborough Antennas & Propagation Conference (LAPC), November 2016

After careful and considered review of the content and authorship of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE's Publication Principles.

This paper copies original text and figures from the paper cited below. The original content was copied without attribution (including appropriate references to the original author(s) and/or paper title) and without permission.

Due to the nature of this violation, reasonable effort should be made to remove all past references to this paper, and future references should be made to the following article:

mm-Wave Contactless Connection for MMIC Integration in Gap Waveguides
by Alhassan Aljarosha, Rob Maaskant, Ashraf Uz Zaman and Per-Simon Kildal
in the Proceedings of the IEEE International Symposium on Antennas and Propagation (APSURSI), June 2016


A contactless, in-line, wideband and low-loss micro strip to GrooveGap waveguide transition operating at X-band is presented. The principle of operation is based on transforming EM fields from the SIW to the RidgeGap waveguide mode via near field electromagnetic coupling. This is advantageous, since the proposed solution avoids the use of metal contact between the SIW and one of the waveguide parts. Furthermore, metamaterial-based gap waveguide technology provides a resonance-free packaging solution for the integrated MMIC amplifier. It is the first time a transition that also provides the packaging of the active component is designed. Our device works on X-band due to present test equipment limitations, but it can be scaled to mm-wave frequencies and beyond.
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