Bonding Of Flexible Mulitlayer Printed Systems Based On Pet-Substrates - An Investigation Of Challenges And Promising Approaches

Flexible, thin and smart multilayer printed systems have a wide range of applications, reaching from human-centred alarm systems to industrial applications like condition monitoring within the scope of Industry 4.0. During the production process for flexible mulitlayer printed systems, the bonding of the individual substrate layers is an important step. Thereby, the functionality of the components and lines printed onto the different layers must not be affected. In this paper, the challenges of the bonding process of flexible printed systems based on Polyethylene Terephthalate (PET) substrates are demonstrated and possible approaches for bonding are introduced and compared to each other.