Thermal Distribution Measurement On Fpga Using Optimized Ring Oscillator (Ro)-Based Thermal Sensor Network

In this paper, thermally aware optimized measurement of field programmable gate array (FPGA)-based systems using ring oscillator (RO)-based thermal sensors is proposed for thermal management. The sensor array was distributed uniformly on the FPGA in a novel layout, and was optimized on allocation using a trade-off between sensor number and measurement resolution. This method is suitable for various applications on FPGAs. To heat the chip and generate hot spots and large temperature gradients for measurement validation, a self-heating test module that uses the FPGA resources is also presented.