Finite element modeling technique for avionics PCB with electronic components in random vibration environment

Electronic components normally experience functional failure due to vibration loads. To envisage the episode of this failure, it is necessary to estimate the vibration response of electronic components mounted on the printed circuit board (PCB). As a continuation to the research work which commenced with PCB level that unravelled the modeling mysteries concerned with accurate modeling of PCBs and their appropriate boundary conditions, the present work addressed the modeling issues allied to PCB with various electronic components having distinguished mounting configurations and are brought to reality with the abetment of Finite Element Analysis (FEA) and experimentation. Modeling approaches used in practice to address modeling part with regard to electronic components limit their scope to the extent of modal analysis. Unfortunately, information about a modeling option which yields to accurate prediction of vibration experienced by the electronic components is not available. Hence, objective of the current research work is to identify accurate & appropriate modeling approach for electronic components with the aid of FEA and experimentation. Comparison of frequencies and vibration response results is made for different modeling methodologies, including their ability of fetching the results swiftly and consistently in assortment with different component mounting configurations.