Physical-aware diagnosis of multiple interconnect defects
2017 International Test Conference in Asia (ITC-Asia)(2017)
Abstract
This paper presents a physical-aware diagnosis technique for failing dies with multiple interconnect defects, including open and bridging. Our diagnosis technique considers fault masking/reinforcement and Byzantine effects. We use a section, a piece of interconnect, as the physical-aware diagnosis unit. We adopt the Single Location in a Cluster (SLIC) technique, where sections with similar simulation failure are grouped into a cluster. Simulations on benchmark circuits demonstrated that our accuracy is much higher than that of a commercial tool, with very close diagnosis resolution, when 10 defects are injected.
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Key words
Physical-aware Diagnosis,multiple defects,open,bridging
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