Analyzing flaws in electric components by scanning acoustic microscopy
Russian Journal of Nondestructive Testing(2017)
摘要
Flaws that occur due to the following processes involved in the production of electronic components have been examined: soldering of crystals to pack bases; assembly of flip-chips; and sealing of integrated circuits with a plastic. The analysis has been performed by scanning acoustic microscopy.
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关键词
acoustic microscope, microelectronic components, internal flaws, inspection
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