A Low-Overhead Integrated Aging and SEU Sensor

Aging has become a critical CMOS reliability issue in nanoscales. In general, the aging effect is exhibited as an increase in the delay of the combinational parts and robustness degradation of memory structures. To monitor the aging state of the combinational parts, this paper proposes an aging sensor that is combined with the flip-flops of a chip. The function of this sensor is based on monitorin...