Expanded-Beam Through-Substrate Coupling Interface For Alignment Tolerant Packaging Of Silicon Photonics

N. Mangal,Jeroen Missinne,Günther Roelkens,J. Van Campenhout,G. Van Steenberge,B. Snyder

2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)（2018）

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摘要

We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.

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关键词

alignment tolerant packaging,downward-directionality grating,silicon photonic chip,expanded-beam through-substrate coupling interface,collimated beam generation,hybrid integrated polymer lens,wavelength 1310.0 nm,SI

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