Signal via coupling effects caused by partially broken high frequency signal return

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)（2017）

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摘要

Chip package to chip package differential signal line measurements were performed to investigate increased via coupling effects. In via fields, the high frequency signal return was spread over different combinations of power and GND vias. Results are discussed for different experiments.

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关键词

HF-measurements,signal via coupling,broken high frequency signal return,packaging

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