Organic Damascene Process for 1.5- $\mu$ m Panel-Scale Redistribution Layer Technology Using 5- $\mu$ m-Thick Dry Film Photosensitive Dielectrics

This paper presents a novel organic embedded trace damascene redistribution layer (RDL) process for panel-scale 2.5-D interposers and high-density fan-out package (HDFO) substrates. A minimum feature size of 1.5-μm line and space using ultrathin polymer dielectrics on glass, silicon, and as well as on organic laminate was demonstrated. This is the first demonstration of a complete set of materials...