Test Structures For Seed Layer Optimisation Of Electroplated Ferromagnetic Films

C. M. Mackenzie Dover,A.W.S. Ross,Stewart Smith,Jonathan G. Terry, Andrew R. Mount,Anthony Walton

PROCEEDINGS OF THE 2018 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS)（2018）

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摘要

This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.

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关键词

Seed layer, test structures, electroplated ferromagnetic films, nickel, integrated magnetic technologies, optimisation, characterisation

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