Evaluation of Chip-Last Fan-Out Panel Level Packaging with G2.5 LCD Facility Using FlexUPTM and Mechanical De-bonding Technologies

FOPLP is attracted more and more attention because it was carried out in panel form for cost-effective products. In this paper, for Chip-last FOPLP manufacturing, we proposed to utilize LCD facilities as well as panel-form plating equipment for RDL manufacturing with ITRIu0027s core technologies, i.e., FlexUPTM and mechanical de-bonding, Besides, a simulation system was built to predict the internal stress of Chip-last FOPLP during de-bonding. This innovative combination creates opportunities for fan-out packaging applications instead of the existing wafer level packaging process.