Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators

S Simone Cardarelli,N Nicola Calabretta,Ripalta Stabile,Ka Kevin Williams, Xiao Luo, Jan Mink

Electronic Components and Technology Conference（2018）

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摘要

A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 mu m(2) misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

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关键词

bimorph piezoelectric actuators,fiber-chip coupling,optoelectronic packaging

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