Application Of Finite Element Simulation Analysis And Calculation In Process Design Optimization

In this study, a failed power supply chip was used as example to solve the problem of external stress (mainly for temperature cycle) cracking of solder joints through the change of the PCB pad design. In addition, through the finite element numerical simulation analysis and calculation method, the life of QFN solder joints before and after optimization was evaluated, and the effective evaluation level quantified the effect of optimization and improvement.