CuPt Alloy Thin Films for Application in Spin Thermoelectrics

Spin thermoelectrics represents a new paradigm of thermoelectricity that has a potential to overcome the fundamental limitation posed by the Wiedmann-Franz law on the efficiency of conventional thermoelectric devices. A typical spin thermoelectric device consists of a bilayer of a magnetic insulator and a high spin-orbit coupling (SOC) metal coated over a non-magnetic substrate. Pt is the most commonly used metal in spin thermoelectric devices due to its strong SOC. In this paper, we found that an alloy of Cu and Pt can perform much better than Pt in spin thermoelectric devices. A series of CuPt alloy films with different Pt concentrations were deposited on yttrium iron garnet (YIG) films coated gadolinium gallium garnet (GGG) substrate. Through spin Seebeck measurements, it was found that the Cu 0.4 Pt 0.6 /YIG/GGG device shows almost 3 times higher spin Seebeck voltage compared to Pt/YIG/GGG under identical conditions. The improved performance was attributed to the higher resistivity as well as enhanced spin hall angle of the CuPt layer.