Wafer-Level Technology For Integration Of Carbon Nanotubes Into Micro-Electro-Mechanical Systems

Jens Bonitz,Simon Boettger, Sascha Herrmann,Stefan E. Schulz,Thomas Gessner,Steffen Hartmann,Bernhard Wunderle

2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)（2016）

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摘要

In this paper we present a holistic wafer-level manufacturing process for nanoscopic sensor devices based on individualized single-wall carbon nanotubes (SWCNTs) integrated in MEMS. The fabrication technology is demonstrated in detail. Moreover, a first application in form of a MEMS test stage for SWCNT strain and reliability experiments is shown.

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关键词

Carbon Nanotubes,Wafer-level Integration,NEMS,in situ TEM

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