3d Monolithic Metal Orifice Plate For Sers Application: A Showcase Of Low Cost Mems Packaging

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)(2017)

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摘要
Electroplating is a low cost process where metal ions in a solution are reduced by an applied electric field onto a conductive substrate. This process has been studied extensively, but is still critical for modern technology and R&D. In the HP inkjet printing business, electroplating is primarily used in the manufacturing the orifice plate (OP) for integrated print-head products. To extend the OP functionality, a novel cost-effective three-dimensional (3D) OP has been developed to address numerous micro-electro-mechanical systems (MEMS) applications; including surface enhanced Raman spectroscopy (SERS).
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关键词
SERS,MEMS packaging,electroplating,orifice plate
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