Modeling And Analysis Of Neuronal Membrane Electrical Activities In 3d Neuromorphic Computing System

Three dimensional (3D) integration technology merged with neuromorphic computing system plays a significant role for the implementation of energy efficient advanced neurobiological architecture. This work explores a novel 3D neuromorphic system that utilizes the Through Silicon Via (TSV) interconnects to build the complicated hardware neural structure. It allows the ultra-high density integrated system and imitates the neuronal membrane electrical activity in a hybrid 3D neuromorphic system. In our designed 3D neuromorphic structure, we extend the innovation in neuronal ion transportation dynamics through the membrane channels using TSVs. The commensal ionic model of a neuronal membrane is developed utilizing the TSV property and the characteristics of the ionic electrical activity through the TSV is determined. Having massively parallel TSVs and configuring them into useful capacitors, the proposed approach could significantly enhance the signal integrity, reduce crosstalk, and thus leverage the heterogeneous integration of 3D neuromorphic IC. The accuracy of the proposed analytical model is evaluated through the comparison of the model giving values to their 3D field extracting values and SPICE simulations.