Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material

The Phase Change Material (PCM) is explored as potential passive thermal solution in package thermal design due to the burst power requirements in the mobile applications. In this paper, a compact model based on the apparent heat capacity method is proposed and implemented in Icepak ^® . The model is validated with the experimental results, also the compact model results are verified with the detailed computational fluid dynamics (CFD) simulations using Fluent ^® solver. The compact model is used to perform the sensitivity study using different commercial PCMs as thermal interface material (TIM) in the bare die package under JEDEC boundary conditions. The effect of conductivity and capacitance is discussed with respect to different PCMs as TIM.