Hot Deformation Behavior of the 20 vol.% TiC/Cu-Al 2 O 3 Composites

Journal of Materials Engineering and Performance(2018)

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摘要
Hot deformation behavior of the 20 vol.% TiC/Cu-Al 2 O 3 composite was studied using the Gleeble-1500D thermo-mechanical simulator with various strain rates at different deformation temperatures. The softening mechanism due to dynamic recrystallization was a feature of the high-temperature true stress–strain curves. The peak stress increased at the lower deformation temperature and the higher strain rate. Microstructure evolution was explored. Thermal deformation activation energy was calculated as 218.9 kJ/mol, and the constitutive equation was established. The processing map was constructed to obtain optimal processing domain of 700-850 °C and 0.001-0.04 s −1 for hot working.
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关键词
constitutive equation, hot compression deformation, processing map, TiC/Cu-Al2O3 composite
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