Electrical–Thermal Characterization of Through Packaging Vias in Glass Interposer

Low-cost thin glass is developed as a promising material to advanced interposers for high density electrical interconnection in 2.5-D and three-dimensional (3-D) integration. In this paper, the electrical-thermal performance of through glass vias is investigated. The distributed transmission lines model for tapered through glass vias (T-TGVs) in signal-ground-signal type differential structure is ...