Hotspot Thermal Management via Thin-Film Evaporation—Part II: Modeling

IEEE Transactions on Components, Packaging and Manufacturing Technology(2018)

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摘要
We developed a unified semianalytical thermal- fluidic model for hotspot (HS) thermal management via thin-film evaporation from well-defined silicon micropillar wicks. The capillary pressure generated at a receding liquid meniscus is matched with the flow resistance of the micropillar wick to estimate the dryout heat flux. In addition to modeling the fluidic transport within the porous wick struct...
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关键词
Heating systems,Heat sinks,Mathematical model,Thermal management,Solid modeling,Mechanical engineering
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