Advanced Packaging Saves the Day! — How TSV Technology Will Enable Continued Scaling
2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)(2017)
摘要
Technology scaling is becoming more difficult and costly with each generation. As we scale below 7nm, there is uncertainty in the methodology that will be used for device formation and integration. Now, more than ever, the use of advanced packaging technologies is needed to help extend the lifetimes of our most advanced fab technologies. In this “More Than Moore” era, transistor density can be considered in terms of volume rather than area, and the proliferation of TSV integration is the key enabling technology.
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关键词
TSV technology,technology scaling,device formation,advanced packaging technologies,advanced fab technologies,TSV integration,More Than Moore era,transistor density
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