Transistor Optimization With Novel Cavity For Advanced Finfet Technology

We present a novel cavity engineering work-we named this cavity as dual-curvature cavity, which improves OFT electrical performance. This new cavity shape design minimizes the source/drain leakage penalty from deeper cavity depth while enabling the transistor performance benefits from larger eSiGe. In addition, this new cavity shape minimizes the penalty of deeper cavity on SDB (single diffusion break) devices through minimizing the facet effect in SDB structure. This work demonstrates that this new cavity shape could improve p-type transistor performance by 4% on top of the Fin shape optimization.