Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications

2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)(2018)

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摘要
Currently ongoing 4th industrial revolution can be mainly described by two emerging technological fields: machine learning (ML) and internet of things (IoT). The success of the former relies on breakthroughs towards a full hardware implementation of deep neural networks. On the other hand, widespread adoption of IoT devices can be rapidly aided by advances in low power non-volatile memory technologies. In this talk, we will discuss the design aspects of simple nanoelectronic devices called memristors for implementation as both fully analog artificial synapses of a hardware neural network, or as a highly-scaled resistive memory element. We will focus on plasma-enhanced atomic layer deposition (PE-ALD) as a key technology providing homogeneous 3D deposition, nm-scale thickness control, as well as necessary stoichiometry tuning, as the ultimate pathway to high density 3D synaptic and memory arrays.
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关键词
memory arrays,high density 3D synaptic,stoichiometry tuning,nm-scale thickness control,homogeneous 3D deposition,plasma-enhanced atomic layer deposition,highly-scaled resistive memory element,nanoelectronic devices,low power non-volatile memory technologies,deep neural networks,IoT devices,internet of things,machine learning,technological fields,4th industrial revolution,memory applications,neuromorphic applications,high density 3D arrays,design aspects,ALD,memristive devices
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