An Improved Design For 2d Arrays Of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, And Characterization

2018 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS)(2018)

引用 5|浏览6
暂无评分
摘要
In this paper, we present the design, modeling, fabrication and initial wafer level characterization of Capacitive Micromachined Ultrasound Transducers (CMUTs) with target operating frequencies suitable for medical imaging and therapy. Using finite element analysis, a multilayer stack of thin film materials for the hexagonal shaped cell membrane was studied. An optimized stack in terms of membrane stress and cell size was selected for device fabrication based on a wafer bonding approach. The modelling, fabrication and characterization are treated within this paper.
更多
查看译文
关键词
CMUT, multi layer membrane, film stress, wafer bonding
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要