Thin glass based photonic and electronic assemblies

Gunnar Bottger,Wojciech Lewoczko-Adamczyk,Henning Schroder,Daniel Weber,Martin Schneider-Ramelow

2018 IEEE CPMT Symposium Japan (ICSJ)（2018）

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摘要

Electronics industry has been very successful in finding size and cost economic packaging forms and strategies. Such standardized packages have not been established for embedding optical or electrical-optical chips, yet. This short proceedings article summarizes some photonic and electronic-photonic assembly realizations and packaging concepts currently pursued at Fraunhofer IZM, in an collaboration with Technical University Berlin.

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关键词

Opto-electronic packaging,automated assembly,thin glass,optical coupling,panel level integration, modular embedding, CSP, MCM, automated assembly

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