Hybrid III-V/Silicon technology for laser integration on a 200 mm fully CMOS-compatible silicon photonics platform
IEEE Journal of Selected Topics in Quantum Electronics(2019)
摘要
In this paper, we present the hybrid III-V/Si photonic platform developed in CEA-LETI. The overall integration is done in a fully CMOS compatible 200-mm technology, scalable to 300-mm wafers, leveraging the large-scale integration capabilities of silicon photonics. III-V material is integrated on top of a mature silicon photonic front-end wafer through direct molecular bonding enabling the monolit...
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关键词
Silicon,Photonics,Lasers,Bonding,Waveguide lasers,Optical waveguides
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