Latent curing epoxy systems with reduced curing temperature and improved stability

•BPA, TCBPA, and TBBPA were used as latent hardeners in adhesives with bisphenol A epoxy resin as matrix.•Imidazole was selected as the accelerator which is stable and non-catalyzed at room temperature.•Curing temperature of EP-BPA, EP-TCBPA, and EP-TBBPA systems can reduced to 126 ℃, 94 ℃, and 106 ℃, respectively.•The as-prepared single component epoxy adhesives are stable and the shelf life for all three systems is five months at least.•Kinetic parameters of curing reaction of all three systems were obtained and their mechanisms were understood.